Cooler Master TPC 812 Vertical Vapor Chamber CPU Cooler

Posted by on Monday, April 9, 2012 - 2:59am

Cooler Master TPC 812Cooler Master is going back to the original concept of outperforming the next cooler. They are doing this by using two proven technologies together to achieve this goal. The two techs are heat pipes and vapor chambers. Each has two different processes to getting the job done. But does this combinations spell out a winner? We will see.

Introduction to the Cooler Master TPC 812 Vertical Vapor Chamber CPU Cooler

It seems like the latest rash of CPU coolers we have reviewed wasn’t about out doing the competition to cool your CPU to its lowest level. But it was more to be quiet, more efficient, to be a smaller footprint or just cost cheaper. To many and me included believe that cooling performance can’t get much better.

Cooler Master is going back to the original concept of outperforming the next cooler. They are doing this by using two proven technologies together to achieve this goal. The two techs are heat pipes and vapor chambers. Each has two different processes to getting the job done. But does this combinations spell out a winner? We will see.

Cooler Master’s take on the TPC

The first ever CPU heat sink to utilize Vertical Vapor Chamber cooling and combine it with heat pipe technology, TPC 812 is prepared to handle the massive heat generated by overclocking and benchmarking. Vertical Vapor Chamber working in tandem with heat pipes and a specialized heat sink and fin design allow the TPC 812 to outperform the competition.


CPU Socket

Intel Socket:
LGA 2011 / 1366 / 1156 / 1155 / 775 *

AMD Socket:
FM1 / AM3+ / AM3 / AM2+ / AM2

CPU Support

Core™ i7 Extreme / Core™ i7 / Core™ i5 / Core™ i3 / Core™2 Extreme / Core™2 Quad / Core™2 Duo / Pentium / Celeron

FX-Series / A-Series / Phenom™ II X4 / Phenom™ II X3 / Phenom™ II X2 / Phenom™ X4 / Phenom™ X3 / Athlon™ II X4 / Athlon™ II X3 / Athlon™ II X2 / Athlon™ X2 / Athlon™ / Sempron™


138 x 103 x 163mm (5.4 x 4.1 x 6.4 in)

Heat Sink Dimensions

134 x 74 x 158 mm (5.3 x 2.9 x 6.2 in)

Heat Sink Material

Copper Base / 2 Vapor Chambers
6 Heat pipes / Aluminum Fins

Heat Sink Weight

826g (1.83 lb)

Heat Pipes Dimensions


Fan Dimension

120 x 120 x 25mm (4.7 x 4.7 x 1 in)

Fan Speed

600 – 2,400 RPM (PWM) ± 10%
(1,600 RPM with Silent Mode Adapter)

Fan Airflow

19.17 - 86.15 CFM ± 10%
(59.54 CFM @ 1600RPM)

Fan Air Pressure

0.31 – 4.16 mm H2O ± 10%
(1.99mm H2O @ 1600RPM)

Fan Life Expectancy

40,000 hrs

Fan Noise Level (dB-A)

19 - 40 dBA

Bearing Type

Long Life Sleeve Bearing



Fan Rated Voltage

12 VDC

Fan Rated Current


Power Consumption


Fan Weight

152g (0.34 lb)


* Supplied accessories may differ by country or area. Please check with your local distributor for further details.


  The TPC 812 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
  Ready for overclocking, benchmarking and silent cooling.
  The first-ever CPU heat sink to use vertical vapor chamber technology.
  100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
  Special fin design – heat sink receives concentrated cold airflow.
  Improved air pressure design and fan mounting system.

Closer look

Cooler Master is aiming the TPC 812 at not only the overclocker but the bencher as well. You know those people that seem to take things one step further in order to get a good score on a particular benchmark together. It’s not regularly we see air coolers on the test setup of a bencher but CM is hoping to change all that.

Before we get into the design of the cooler we will mention some of the basic specifications of the cooler first. CM states that weigh a ‘moderate’ 2.31 pounds fully assembled; we consider this more than moderate but well in reason. The cooler is made of thick aluminum fins and has a pure copper base.

What is it that CM is hyping the TPC 812 as the top cooler? Well, it is all in the design. The cooler used two well known methods of cooling to get the job done. Heat pipes and vapor chambers are both used to take away as much if the heat as possible from the CPU. The similarities between the two are pretty much the same. Normally, heat pipes are round mostly and can be bent and flatten at one point depending on the manufacturer’s preference. Vapor chambers are made from stamped or forged chambers so no bending or flatten can take place.

Being brief they both adsorb heat through the exterior metal in which they are made of. The heat enters and with the use of a liquid vaporizes the heat. It travels upwards where it enters a cooler point and transfers out. The dissipation of the heat or vapor can be accelerated with the aid of aluminum fins. Researching this a little we found that vapor chambers works better due to its higher heat transfer and lower thermal resistance. 130W each chamber better according to CM referring to the TPC 812.

In the case of the TPC 812, the vapor chambers are made larger than the six heat pipes (6mm diameter) given them (vapor chambers) an area of contact with the fins of the cooler. This solution eliminates the need for a loud power cooling fan making for a much quieter overall cooling solution.

 The 120mm fan that comes with the TPC 812 is rated at 800 to 2400 RPM.  The fan and its specifications is a large part of why CM can gear the CPU to all levels of PC users. Slow it down when the overclock is only moderate and you want to do some gaming. Or turn it up when it is time to obtain your personal best in your favorite benchmark app.

The base of the cooler is made of pure copper. Both vapor chambers and the six heat pipes came in contact with the base but not the CPU.

The cooler comes with everything to attach it to Intel LGA 2011/1366/1156/1155/775 and AMD AM1/AM3+/AM3/AM2+/AM2 sockets. Only one fan is included but included are another fan bracket to add another fan.

Mounting images

Testing Methodology

For our testing we will be using the following procedures and parameters to acquire the necessary data:

  1. Thermal compound used is Arctic Silver 5
  2. Idle temperatures are recorded after the system has been allowed to idle for thirty minutes from the point Windows has finished loading.
  3. Load temperatures are recorded by running OCCT for twenty minutes on all available threads.
  4. Real Temp is used for the recording of all temperature sensor reading.
  5. PWM function is disabled via BIOS to allow the fans to run at full speed.
  6. CPU model and overclock speed used for testing are outlined below in "Test Hardware".
  7. Each cooler is tested with one fan(s) supplied from the manufacturer.

Test Hardware:
Motherboard: ASUS X79 Deluxe
Processor: Intel Core-i7 3930K @ 4.6GHz w/ 1.4 voltages
Ram: Crucial 2133 16GB Dual Channel (9-9-9-24)
Video Card: ASUS Radeon HD 5870
HDD: Hitachi 1TB
Power: Thermaltake Tough Power XT 850 (Sponsored by Thermaltake)
Case: Open air
Cooling: Cooler Master TPC 812




We found that the Cooler Master TPC 812 is one heck of a cooler. Due to the change in platforms we were only able to put the new cooler up against one other cooler. But that cooler used two 120mm fans and was able to take it down. And another plus while achieving this is the cooler remained quiet. Making it one of the best noise-versus-performance we ever tested. The ideal of using the dual thermal cooling solutions was a good one as it performed like advertised.

The Cooler Master TPC 812 cooler will retail for $69.99 once in stores. I like the cooler in this price range as the performance I good to great. And won’t break the bank of most that are out to buy a better cooler.

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