Upon release, we reviewed the flagship of the Kaby Lake lineup, the Core i7-7700K. We came away rather impressed. Not only did it outperform the previous generation Core i7-6700K, it also proved to be a more capable overclocker. This time we have the Core i3-7350K. The Core i3 has half the hyperthreaded cores of a Core i7 and half the L3 cache at 4 MB. However Turbo Boost is disabled. Like its bigger brother, it features an unlocked multiplier though, for easy overclocking. This is something we haven’t seen since the 1st generation Core processors.
Cases today are adapting to new technologies every time. One technology in particular that’s becoming a mainstream today is the Type-C port coming from both USB 3.0 and USB 3.1 interfaces. Both offer fast data transfer rates making it ideal for those that move around large media content from device to device. Gladly, SilverStone always adopts the latest technologies and incorporate it to their latest cases, one of which is going to be tested today. Follow us as we take a look at the SilverStone Redline Series RL05 chassis that sports a USB 3.0 Type-C port in front and two 140mm LED fans in front for superior cooling.
On August 30, 2016 Intel announced its next generation processor, Kaby Lake. They also announced that Kaby Lake would continue to use their 14 nanometer process that had been used with the two previous generations, Skylake and Broadwell. It had been highly anticipated the 10 nanometer Cannonlake would be the successor to Skylake, so it raised a few eyebrows and even more questions, as this broke with Intel long standing “tick-toc” manufacturing and design model. Instead Kaby Lake would represent a further optimization on Skylake’s architecture. Indeed, Intel has replaced the “tick-tock” with a "process-architecture-optimization" model.
With transistors getting smaller and smaller and more and more difficult to produce in sufficient yields, Intel’s long running two step “Tick Tock” cadence is now being replaced with a 3 phase model of Process, Architecture, and Optimization. Intel’s Broadwell, while never fully released as a complete line of Desktop CPU’s, saw the Process shrink from 22nM to 14Nm with the Intel Core 5000 series CPU’s. The Architecture upgrade was done with Intel 6th Generation 6000 series CPU’s, and now we come to the 7th Generation CPU’s that target optimization. To take advantage of these optimizations, Intel has release the 200 series chipsets, and the top end enthusiast level version is the Intel Z270 Chipset found in the ASRock Z270 Extreme4 we have for review today.
Certainly when it comes to motherboards, the high end enthusiast products get all the attention, while the more budget friendly options fly under the radar. That’s a shame too. The more budget friendly products are really the bread and butter of the industry. MSI’s Pro Series motherboards are aimed directly at those enthusiasts that have less than an unlimited budget.
With the upcoming launch of Intels new 7th generation of Core Processors, there’s no surprise that we are starting to see new motherboards with Intel’s new Z270 chipset as well. With new features, such as support for Intel’s new Optane SSDs, more downstream PCIe lanes, 14 to the previous 10 that the Z170 chipset has and even front USB 3.1 support, The Z270 chipset is an upgrade over the Z170 chipset.