CoolIT Systems to Showcase Best-in-Class HPC Liquid Cooling Offering at SC16
Booth 1843 to debut latest Heat Exchange, Chip-to-Atmosphere™ case study and coldplate solutions
Calgary, AB. November 14, 2016 – CoolIT Systems, Inc. (CoolIT), the world leader in energy efficient liquid cooling technologies for HPC, Cloud and Enterprise markets, is returning to the Supercomputing Conference 2016 (SC16) in Salt Lake City, Utah for the fifth consecutive year as an Exhibitor and host of a Birds-of-a-Feather panel session.
CoolIT offers the broadest range liquid cooling devices in the industry and will introduce a number of new products at SC16. Among the new solutions is a rack mounted liquid-to-air CDU that allows users to realize the benefits of liquid cooling without the requirement of facility water. Also on display is the complete range of Rack DCLC™ heat exchangers, including the powerful 4u rackmount CHx80 which manages 80 kW of IT load with warm water (Ashrae W4).
Active and passive coldplates for new processor technologies, including solutions engineered for the Intel® Xeon Phi™ x200 Processor Product Family (Knights Landing) and the next generation Intel® Xeon® E5 processor (Skylake EP) family will be showcased. In addition, CoolIT has announced coldplate solutions for the NVIDA® Tesla P100 (Pascal) and the AMD® FirePro™ S9300 x2.
At the ISC High performance (ISC16) show earlier this year, CoolIT and STULZ announced the Chip-to-Atmosphere™ partnership that delivers end-to-end solutions for all HPC cooling, installation and service requirements. Debuting at SC16 is the new MicroDC product – an IT cabinet that integrates CoolIT’s Rack DCLC™ CHx80 and STULZ’s CyberRow in a single solution that contains 100% of the IT heat. This room-neutral and highly efficient system allows for densities of 65kW with 35°C (95°F) facility inlet water.
Server solutions from several major OEM’s will be displayed, including:
· Hewlett Packard Enterprise Apollo 2000 System with the option to integrate liquid cooling through CoolIT’s Closed-Loop DCLC™ product line or Rack DCLC™ product line (compatible with CoolIT’s Heat Exchange Modules for organizations of all sizes to achieve maximum data center potential.)
· NEC Blue Marlin with CoolIT’s high-performance RP2 Passive Coldplate Assembly, specifically designed for Intel Xeon Phi x200 Knights Landing Processor.
· Dell PowerEdge C6320 with dedicated liquid cooling to the CPUs, VR and Memory.
“We have assembled a comprehensive display of technology and OEM solutions to address all liquid cooling requirements in the global HPC market,” said CoolIT Systems CEO and CTO Geoff Lyon. “Our partnership with STULZ provides the market with the benefits of a single vendor to implement and service HPC cooling solutions in over 140 countries – truly a unique offering.”
CoolIT will be featuring a case study on the exceptionally green data center cooling solution at the Poznan Supercomputing & Networking Center (PSNC). The PSNC “Eagle” cluster uses 1,032 liquid cooled Huawei CH121 servers to increase density and reduce energy consumption. PSNC was able to deploy this new cluster without having to invest in additional expensive cooling infrastructure. The hot return water from the cluster is also being recycled for local heating needs.
CoolIT has also been selected to host SC16 Birds-of-a-Feather session “Today’s Hot Technology: The Growing Necessity of Liquid Cooling in HPC”, 5.15pm-7.00pm on Tuesday 15 November in Room 355-D, Salt Palace Convention Center. Panelists include Geoff Lyon (CoolIT Systems), Wade Doll (Cray), Sammy Zimmerman (Hewlett Packard Enterprise), Michael K Patterson (Intel) and Steven Hammond (National Renewable Energy Laboratory). Topics of interest include education of customers, training for and management of installations and upgrades, international service requirements, and the ongoing responsibility for every step of the innovation to be as efficient and environmentally friendly as possible despite the incredible processing power.
To learn more about how CoolIT’s products and solutions maximize data center performance and efficiency whilst significantly reducing OPEX and overall TCO, visit SC16 booth 1843. To set up an appointment, contact Lauren Macready at marketing(at)coolitsystems(dot)com.
About CoolIT Systems
CoolIT Systems, Inc. is the world leader in energy efficient Direct Contact Liquid Cooling for the Data Center, Server and Desktop markets. CoolIT’s Rack DCLC™ platform is a modular, rack-based, advanced cooling solution that allows for dramatic increases in rack densities, component performance, and power efficiencies. The technology can be deployed with any server and in any rack making it a truly flexible solution. For more information about CoolIT Systems and its technology, email or visit http://www.coolitsystems.com/.
About Supercomputing Conference (SC16)
Established in 1988, the annual SC conference continues to grow steadily in size and impact each year. Approximately 5,000 people participate in the technical program, with about 11,000 people overall. SC has built a diverse community of participants including researchers, scientists, application developers, computing center staff and management, computing industry staff, agency program managers, journalists, and congressional staffers. This diversity is one of the conference’s main strengths, making it a yearly “must attend” forum for stakeholders throughout the technical computing community. For more information, visit http://sc16.supercomputing.org/.