GIGABYTE unveils AORUS X470 Gaming Motherboards
Peak motherboard performance for the latest AMD platform
Taipei, Taiwan, April 13th, 2018 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, is releasing the new AORUS X470 Gaming motherboards based on the AMD X470 Chipset. This launch follows the announcement of 2nd Gen AMD Ryzen™ Processors. The motherboards themselves represent the pinnacle of performance on this new AMD platform by means of an updated power design with up to 10+2 power phases, future-proof connectivity with USB Type-C as well as improved Audio and Wi-Fi capabilities. All this is concealed by a new overall motherboard design that better showcases the dominant ascension of the AORUS eagle.
The first AORUS X470 motherboards on the market are the X470 AORUS GAMING 7 WIFI, the AORUS GAMING 5 WIFI and the AORUS ULTRA GAMING. This selection of boards covers a wide spectrum of price points and features while providing all the performance and novelties of the new chipset, including the Gen3 PCIe lanes enabling support for 2-Way CrossFire/SLI configurations.
Built on 12 nm technology and using the long-standing AM4 socket, the new 2nd Gen AMD Ryzen™ CPUs offer more than 10% performance improvement over their predecessors and are presented with a variety of models where flagship Ryzen™ 7 2700X is a processor with 3.7 GHz base clock and 4.35 GHz boost clock accompanied by other Ryzen™ 7 and Ryzen™ 5 CPUs ranging from 6 cores and 12 threads up to 8 cores and 16 threads.
AORUS X470 motherboards boast up to 10+2 power phases using all digital VRM solutions from IR paired with input configurations of 8+4 solid pin connectors, providing incredibly precise power delivery with server level reliability. Each power phase is capable of providing up to 50A of power to the most power hungry and energy-sensitive components.
This critical area of the motherboard utilizes a new advanced thermal design. Designed for unparalleled VRM cooling performance the newly designed heatsinks use a Stacked Fin array, called Fins-Array, which offer a 300% greater surface area than traditional heatsinks. The new heatsink also features a Heatpipe with Direct Touch for enhanced heat transfer. The use of Base Plate Armor in this area further increases the quality of the platform foundation brought by the new AORUS X470 motherboards.
The quality of onboard audio featuring the updated Realtek ALC1220-VB codec and ESS SABRE DAC teleports users into the realm of virtual battlefields, epic tales and vibrant concerts with the most immersive sound experiences. This upgrade brings out the vibes of the front/rear microphone up to a 110/114 dB SNR and presents a distinct advantage for gamers who prefer to use the front panel audio to hear their opponents and communicate with their team.
A comprehensive number of connectivity options is available on these AORUS X470 motherboards, including a dual PCIe x4 M.2 SSD slot design for anyone seeking the storage performance up to 32 Gb/s using NVMe drives and even allowing various RAID modes. Geared with M.2 Thermal Guards to prevent thermal throttling on such devices, the motherboards allow users to uphold the highest transfer speeds at all times. With the advent of USB 3.1 Type-C connection, all AORUS X470 motherboards include a front panel header, laying the foundation for future chassis and external devices.
Speeds of up to 1.73 Gb/s via a wireless connection is now a reality on AORUS X470 motherboards equipped with next-gen Intel® Wireless 802.11ac Wave 2, even surpassing that of wired connections. The smooth video streaming and gameplay quality achieved with a Wi-Fi connection 4x faster are game-changing for the various forms of entertainment popular in today’s world.
AORUS X470 motherboards include additional built-in technologies with an emphasis on performance, style, and durability. The 2nd Gen AMD Ryzen™ Processors truly benefit from having a strong companion cooling technology such as the renowned Smart Fan 5, with a combination of hardware and software features, keeping the system cool even while executing highly demanding tasks at peak performance levels. Customization possibilities are greater than ever on this new AMD platform with a total of 4 headers for external LED lighting strips. The added support for Digital LEDs allows for virtually unlimited patterns and styles.
The new design found on these motherboards is inspired by the wings of an eagle. The sleek contour of the I/O armor resembles the shape of the wing while the claw marks and airflow design represent the wing’s impressive aerodynamic features. It’s finally possible to harness every bit of performance from the new AMD Ryzen™ CPUs and fulfill your gaming dreams with the AORUS X470 Gaming motherboards.
To learn more about AORUS: http://www.aorus.com
To learn more about GIGABYTE: http://www.gigabyte.com