STULZ USA Announces Strategic Investment and Commercial Partnership with CoolIT Systems
High Density Chip-to-Atmosphere Data Center Solutions to be the Partnership Focus
Frederick, MD. May 24, 2016 – Leading global mission critical cooling solutions provider STULZ, through its US entity STULZ Air Technology Systems, Inc. (STULZ USA), has engaged in a strategic investment and commercial partnership with CoolIT Systems, Inc. (CoolIT), a global manufacturer of energy efficient Direct Contact Liquid Cooling (DCLC™) technologies for High Performance Computing, Cloud and Enterprise markets.
The commercial partnership will enable the two companies to cooperate closely in delivering unique Chip-to-Atmosphere solutions across the globe. Both parties remain independently owned and operated.
“STULZ has identified Chip-to-Atmosphere cooling solutions as a growing market segment for data center environments,” said Joerg Desler, President of STULZ USA. “This alliance with CoolIT allows us to offer customers more complete solutions that involve capturing the heat at source inside the servers and moving it out to the atmosphere with STULZ technology.”
CoolIT’s DCLC technology uses the exceptional thermal conductivity of liquid to provide concentrated cooling to the hottest components inside a server, enabling very high density configurations. CoolIT’s centralized pumping liquid cooling solutions can be tailored to any server layout and have already been adopted by many server manufacturers as a reliable technology that is covered under standard warranties.
“Partnering with such an influential solution provider as STULZ provides a tremendous worldwide capacity to our company,” said Geoff Lyon, CEO & CTO at CoolIT Systems. “This strategic relationship increases our ability to better serve the data center industry with forward thinking designs, solutions and services.”
“CoolIT Systems is attractive to the global STULZ Group because they align well with STULZ’ history of bringing innovation and highly efficient technology to the data center market,” said STULZ USA Vice President Brian Hatmaker. “We see a growing need in the market for more flexible solutions to support high performance and high density compute applications. Chip-to-Atmosphere solutions will generate immediate CAPEX and OPEX savings with minimal footprint requirements.”
The Chip-to-Atmosphere concept will be discussed in detail at ISC High Performance 2016 in Frankfurt during CoolIT Systems Exhibitor Forum Presentation: 4.40pm on Tuesday 21 June at Booth 500, Hall 3, Messe Frankfurt. Technical experts will also be available during ISC16 to answer any questions at CoolIT Systems booth, #1210.
Those interested in incorporating CoolIT Systems and STULZ solutions in their projects should start by contacting their local STULZ or CoolIT Systems sales representative.
About STULZ Air Technology Systems, Inc.
STULZ Air Technology Systems, Inc. (STULZ USA) is an ISO 9001 registered manufacturer of environmental control equipment including a full line of energy efficient precision air conditioners, air handling units, ultrasonic humidifiers, and desiccant dehumidifiers. The company is responsible for product development, manufacturing, and distribution for the North American arm of the international STULZ Group. For more information about STULZ USA and its products, call 301-620-2033. E-mail your request to [email protected] or visit www.stulz-usa.com.
CoolIT Systems, Inc.
CoolIT Systems, Inc. is the world leader in energy efficient Direct Contact Liquid Cooling for the Data Center, Server and Desktop markets. CoolIT’s Rack DCLC™ platform is a modular, rack-based, advanced cooling solution that allows for dramatic increases in rack densities, component performance, and power efficiencies. The technology can be deployed with any server and in any rack making it a truly flexible solution. For more information about CoolIT Systems and its technology, email [email protected] or visit http://www.coolitsystems.com/.